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通过晶圆减薄提高 WL-CSP 的可靠性
Abstract WL-CSP is a low profile, true chip size package that is entirely built on a wafer using front-end and back en...
用于高密度晶圆互连的微加工晶圆减薄
Abstract ¾ Thinning of micromachined wafers containing trenches and cavities to realize through-chip interconnects is pr...
表面粗糙度对晶圆直接键合的影响
I. INTRODUCTION The mechanism of direct wafer bonding at room temperature has been attributed to the short range intermo...
晶圆级石墨烯集成电路
A wafer-scale graphene circuit was demonstrated in which all circuit components, including graphene field-effect transis...
晶圆级微光学工艺
ABSTRACT Micro-optics is an indispensable key enabling technology (KET) for many applications today. The importan...
晶圆级制造的热气动可调微透镜
We have developed a self-contained, liquid tunable microlens based on polyacrylate membranes integrated with compact on-...
晶圆键合的基本问题
Semiconductor wafer bonding has increasingly become a technology of choice for materials integration in microelectronics...
外延晶圆中金属污染的表征
Metal contamination is the dominant cause of device failure. In the case of an epitaxial (Epi) wafer, trace metal may we...
晶圆干燥工艺中清洁技术的发展
Abstract In the aqueous processing of silicon wafers, drying of wafers must take place after each processing step. Howev...
去除晶圆表面颗粒的方法
Abstract: A big yield drop has been observed during the automatic inspection (AOI) after the saw stage. A step by step A...