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有机污染物在晶圆表面的吸附行为
ABSTRACTSilicon wafers can adsorb volatile organic compounds present in the air of the enclosed environmentsin the clean...
晶圆级封装的可靠性分析
AbstractWafer level packaging (WLP) has been growing continuously in electronicspackaging due to its low cost in batch m...
晶圆上金刚石薄膜的化学辅助机械抛光
AbstractDiamond has been well recognized a strategic engineering material. It possesses excellentphysical and chemical p...
晶圆键合制造技术回顾
AbstractTechniques for fabricating strained Si, SiGe, and Ge on-insulator include SIMOX, Ge condensation and waferbondin...
使用晶圆级方法评估设备可靠性
ABSTRACT:This paper demonstrates the viability of wafer-levelmethods as a means of evaluating device reliability usingsp...
MEMS制造应用的晶圆级气密封装
AbstractIn order to simplify the processing complexity andcut down the manufacturing cost, a new wafer bonding technique...
晶圆级键合工艺
Abstract The objective of this study was to develop a fullyintegrated process for wafer level MEMS packagingutilizingPol...
晶圆级微光学制造
AbstractMicro-optics is an indispensable key enabling technologyfor many products and applications today. Probably the m...
自动化超薄晶圆生产的处理
ABSTRACT: New approaches for future photovoltaic cell concepts issue a challenge to crystalline wafer handlingEspecially...
快速扩大 GaAs晶圆背面处理的挑战
ABSTRACTThe dramatic increase in demand for GaAs basedpHEMT and HBT devices has required the expansion ofwafer FAB capac...