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解决马兰戈尼干燥过程中晶圆接触痕污染问题的新方法
Contact mark contamination of Si wafers in Marangoni drying is related to water retention at the contact area between wa...
半导体晶圆键合
ABSTRACTWhen mirror-polished, flflat, and clean wafers of almost any material are brought into contact at room temperatu...
薄晶圆处理挑战和新兴解决方案
Temporary bonding attaches substrates to a carrier so that after thinning to the desired thickness further backside fabr...
采用全覆盖超音速旋转工艺的高效晶圆背面清洁
A single wafer cleaning system with full coverage back-side megasonics has been developed for pre-lithography backside c...
晶圆背面清洁工艺
Abstract –With each new advanced technology node, minimum feature sizes continue to shrink. As a result, the devices bec...
高效单晶圆清洗工艺
Abstract. Current work describes development, testing and verification of a single wafer megasonic cleaning method util...
堆叠结构的晶圆及其减薄方法
Abstract— Wafer-to-wafer 3D integration has a potential to minimize the Si thickness, which enables us to connect mult...
MEMS 器件的金属晶圆键合
AbstractMetal fifilms can be used as bonding layers at wafer-level in MEMS manufacturing processes for device assembly a...
通过原子氢表面清洁实现GaAs晶圆键合
A method of large-area wafer bonding of GaAs is proposed. The bonding procedure was carried outin an ultrahigh vacuum. T...
使用晶圆键合机的晶圆级芯片规模封装
ABSTRACTAn in-house processing capability is developed in this research for silicon-glass bonding for microfabrication a...